Ultra wideband Wireless (UWB) - Current Technology & Future Challenges

Speaker:	Dr. P.G. Madhavan
		Wireless Architect, Microsoft Corp
		WiMedia Alliance Board of Director Member

Title:		"Ultra wideband Wireless (UWB) - Current Technology
		 & Future Challenges"

Date:		Friday, 6 October 2006

Time:		4:00pm - 5:00pm

Venue:		Lecture Theatre G
		(Chow Tak Sin Lecture Theater, near lift nos. 25/26)
		HKUST

Abstract:

The promise of UWB is giga-bit wireless for IP-transport and cable
replacement. UWB's promise goes far beyond Bluetooth as it is architected
with networking in mind. WiMedia Alliance (similar to IEEE 802.11) is a
standards body that has developed specifications for PHY, MAC and "WiNet"
(IP-over-UWB). The same PHY/MAC can be used for WUSB (Wireless USB) which
is primarily intended for cable replacement.

After a brief review of the PHY and MAC, this talk will focus on WiNet.
WiNet in combination with Wi-Fi can enable brand new scenarios involving
high-definition (HD) video distribution. Future version of WiNet (called
Gen2) provides many challenges in mesh networking technology,
software-defined radio and cognitive radio. We will explore new research
and product opportunities that will be spawned by the Gen2 work.


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Biography:

PG is an Architect in the Wireless Networking division of Microsoft Corp
based in Redmond, WA. His main responsibilities are in the areas of
product, systems architecture and standards development related to UWB
wireless.

Since 2003, he has been with Microsoft Corporation working on various
wireless incubation projects. Previously, he worked for Lucent/Agere in
the areas of Bluetooth, LAN/PAN coexistence and EDGE. Before that, he was
with Rockwell Automation working in the areas of strategic marketing,
product development, software quality and advanced technology.

PG obtained his Ph.D. in Electrical and Computer Engineering from McMaster
University, Canada. He has been a professor at various universities
including University of Michigan, Ann Arbor. He has over 50 publications
and 7 U.S. patents issued. He is a Senior Member of IEEE.